COOK AND WEIL, INC. Federal Contracts — Government Award History
Total (All Time)$193,598
Latest FY$193,598
Primary AgencyNational Aeronautics and Space Administration
COOK AND WEIL, INC. has received $193,598 in total federal contract awards
across 1 fiscal year(s). Peak year was FY2025 ($193,598).
Primary awarding agency: National Aeronautics and Space Administration.
Data covers largest contracts by award amount. Source: USASpending.gov (FPDS).
Awards by Fiscal Year
| Year | Spending | Total | Contracts | Top Agency |
|---|---|---|---|---|
| FY2025 | $193,598 | 4건 | National Aeronautics and Space Administration |
Notable Contracts
| Date | Agency | Amount | Description |
|---|---|---|---|
| 2021-10-14 | Department of Defense | $126,690 | WEDGE AND BALL BONDER |
| 2023-08-15 | Department of Defense | $115,735 | SET OF WIRE BONDERS CONSISTING OF ONE (1) GOLD WIRE BALL BONDER AND ONE (1) HEAV |
| 2025-08-14 | National Aeronautics and Space Administration | $68,845 | TPT SEMI-AUTOMATIC HEAVY WIRE BONDER |
| 2024-09-27 | Department of Defense | $59,595 | SEMI-AUTOMATIC THERMOSONIC WIRE BOND SYSTEM |
| 2024-11-07 | Department of Defense | $47,960 | TPT SEMI-AUTOMATIC THERMOSONIC WIRE BONDER PACKAGE |
| 2025-09-22 | Department of Commerce | $46,000 | OU68-25-NEW-255 MANUAL WEDGE/BALL WIRE BONDER |
| 2022-08-19 | Department of Defense | $43,335 | WIRE BONDER |
| 2021-03-01 | Department of Defense | $38,650 | THERMOSONIC WIRE BONDER PACKAGE |
| 2025-07-22 | National Aeronautics and Space Administration | $30,793 | SILICON WAFER BALL BONDER |