SIENNA TECHNOLOGIES, INC. Federal Contracts — Government Award History
Total (All Time)$353,000
Latest FY$353,000
Primary AgencyNational Aeronautics and Space Administration
SIENNA TECHNOLOGIES, INC. has received $353,000 in total federal contract awards
across 1 fiscal year(s). Peak year was FY2024 ($353,000).
Primary awarding agency: National Aeronautics and Space Administration.
Data covers largest contracts by award amount. Source: USASpending.gov (FPDS).
Awards by Fiscal Year
| Year | Spending | Total | Contracts | Top Agency |
|---|---|---|---|---|
| FY2024 | $353,000 | 3건 | National Aeronautics and Space Administration |
Notable Contracts
| Date | Agency | Amount | Description |
|---|---|---|---|
| 2024-02-06 | National Aeronautics and Space Administration | $143,750 | HF2C SIC PRESSURE-TEMPERATURE SENSORS PACKAGING |
| 2024-06-11 | National Aeronautics and Space Administration | $143,750 | DRPA SENSOR CHIPS |
| 2026-02-27 | National Aeronautics and Space Administration | $136,040 | SILICON NITRIDE FOR SENSOR PACKAGING FOR HIGH TEMPERATURE APPLICATIONS |
| 2020-05-29 | National Aeronautics and Space Administration | $126,000 | PACKAGING OF DRPA AND HTP SILICON CARBIDE PRESSURE SENSORS |
| 2022-03-08 | National Aeronautics and Space Administration | $96,000 | PACKAGING OF ON-CHIP INTEGRATED SILICON CARBIDE PRESSURE AND MICRO-TC SENSORS |
| 2021-06-25 | Department of Defense | $68,418 | CUSTOM BOARD FABRICATION |
| 2024-08-26 | National Aeronautics and Space Administration | $65,500 | MULTI-CHIP MODULE PACKAGING OF SIC PRESSURE SENSORS AND ELECTRONICS |
| 2019-05-07 | National Aeronautics and Space Administration | $60,500 | PACKAGING SILICON CARBIDE PRESSURE SENSORS |
| 2026-01-30 | Department of Defense | $53,228 | 1003-02 – ATTENUATORS |
| 2019-04-09 | National Aeronautics and Space Administration | $41,500 | PACKAGING OF NASA GRC SIC SENSORS |